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Physical Dimensions
Product-Specific Dimensions
Product
FAN5340UC
D
1.570
E
1.570
X
0.285
Y
0.285
Figure 23.
8-Bump, 1.57 x 1.57mm Wafer Level Chip-Scale Package (WLCSP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/ .
? 2010 Fairchild Semiconductor Corporation
FAN5340 ? Rev. 1.0.1
10
www.fairchildsemi.com
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